PCB design & layout
Schematic capture through to manufacturing-ready output. Multilayer boards, mixed-signal work, RF-aware routing, and manufacturability checked from the first placement.
- Schematic capture and design review
- Multilayer layout, 2 to 10+ layers
- Controlled impedance, differential pairs, high-speed routing
- Power integrity, thermal and EMC-conscious stackups
- Gerber, ODB++, drill, pick-and-place and BOM output
- Design for manufacture and assembly (DFM/DFA) review